- Manufacturer :
- Hirose
- Product Category :
- Arrays, Edge Type, Mezzanine (Board to Board)
- Connector Type :
- Receptacle, Center Strip Contacts
- Contact Finish :
- Gold
- Contact Finish Thickness :
- 1.97µin (0.050µm)
- Features :
- Solder Retention
- Mated Stacking Heights :
- 0.6mm
- Mounting Type :
- Surface Mount
- Number of Positions :
- 10
- Number of Rows :
- 2
- Product Status :
- Active
- Datasheets
- BM57B0.6-10DS/2-0.3V(53)
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| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| BM57B0.6-10DP/2-0.3V(51) | Hirose | 35,000 | CONN HDR 0.3MM SMD 10POS + 2PWR |
| BM57B0.6-10DP/2-0.3V(53) | Hirose | 35,000 | CONN HDR 0.3MM SMD 10POS + 2PWR |
| BM57B0.6-10DS/2-0.3V(51) | Hirose | 35,000 | CONN RCPT 0.3MM SMD 10POS + 2PWR |
| BM57SPP03MC2-000401 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPP03MC2-000501 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPP05MC2-000101 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPP05MC2-000401 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPP05MC2-AD0201 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPP05NC2-0001AA | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPPS3MC2-000301 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPPS5MC2-000301 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
| BM57SPPS5MC2-000401 | Microchip Technology | 35,000 | MODULE WIRELESS BLUETOOTH |
