- Manufacturer :
- Hirose
- Product Category :
- Arrays, Edge Type, Mezzanine (Board to Board)
- Connector Type :
- Header, Outer Shroud Contacts
- Contact Finish :
- Gold
- Contact Finish Thickness :
- 1.97µin (0.050µm)
- Features :
- Solder Retention
- Mated Stacking Heights :
- 0.6mm
- Mounting Type :
- Surface Mount
- Number of Positions :
- 10
- Number of Rows :
- 2
- Product Status :
- Active
- Datasheets
- BM23FR0.6-10DP-0.35V(895)
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